Vecstar™ FCCL (Flexible Copper Clad Laminates) is made from Kuraray’s liquid crystal polymer (LCP) film and developed using Kuraray’s proprietary film-forming technology. It shows excellent electrical properties suitable for high-speed transmission lines and high-frequency electric devices.

  • Dielectric constant (Dk) 3.3
  • Dielectric dissipation factor (Df) 0.002
  • Moisture absorption 0.04%
  • Melting temperature 280-310degC
  • Excellent Dimensional stability
  • Excellent adhesion to low-profile copper foil
  • Excellent adhesion to other materials in multilayer stack up
  • Low dielectric dissipation
  • Low water absorption
  • Good solder heat resistance
  • Good processes-ability
  • Q series
  • F series

Flexible Printed Circuit substrate for:

  • Smartphones antennas
  • Base station antennas
  • CCD cameras
  • Digital appliance display modules
  • Millimeter-wave radar for auto