Vecstar™ FCCL (Flexible Copper Clad Laminates) is made from Kuraray’s liquid crystal polymer (LCP) film and developed using Kuraray’s proprietary film-forming technology. It shows excellent electrical properties suitable for high-speed transmission lines and high-frequency electric devices.
- Dielectric constant (Dk) 3.3
- Dielectric dissipation factor (Df) 0.002
- Moisture absorption 0.04%
- Melting temperature 280-310degC
- Excellent Dimensional stability
- Excellent adhesion to low-profile copper foil
- Excellent adhesion to other materials in multilayer stack up
- Low dielectric dissipation
- Low water absorption
- Good solder heat resistance
- Good processes-ability
- Q series
- F series
Flexible Printed Circuit substrate for:
- Smartphones antennas
- Base station antennas
- CCD cameras
- Digital appliance display modules
- Millimeter-wave radar for auto
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